HGTECH Copper Bar laser Glue Removal Equipment (Online) is used to remove residual colloids around and on the surface of chip modules, including edge glue, overflow glue, curing glue, etc., to improve the reuse rate and production yield of chips. The equipment mainly consists of fiber laser system, main control cabinet, streamline platform, electric module, vibrating mirror optical path system, visual positioning/detection, smoke purifier, integrated components for blowing and dust extraction, etc. Can carry AGV carts or handcarts.

Equipment Features

Automated processing: The laser debonding machine can be equipped with an automated loading and unloading system, which can place multiple chip magazines and achieve fully automated processing throughout the entire process without manual intervention, greatly improving production efficiency.

High precision and efficiency: The laser glue removal software can automatically match the glue removal line, and the high-resolution CCD achieves automatic positioning, with fast response, high speed, high precision, and easy control, resulting in high glue removal efficiency.

Non destructive: Due to the precise temperature control during the laser debonding process and the short action time of the laser beam, it will not cause thermal damage or structural damage to the material itself, ensuring the integrity and performance stability of the material, and minimizing damage to the coating.

Modular design: The device has a compact structure, occupies a small area, and is easy to install and use. Meanwhile, modular design makes the equipment easy to disassemble and clean, facilitating users' daily maintenance and upkeep.