Wafer Laser Slotting Equipment
This equipment is designed for 8-inch and above chip sealing and testing plants, and is applied to low-k wafers and silicon-based Gan wafers with 40nm and below in the semiconductor industry.

Product Data

Product advantages:

  • High quality

          Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position

  • High efficiency

          Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast

  • High integration

          Integrated protective liquid coating, wafer slotting and cleaning module

 

Sample display:

 

Low-k wafer slotting, depth > 10 μm, Width: 40 μm.

laser cutter

 

laser cutter

 

laser cutter

Item

Main parametetrs

Laser

Center wavelength

~532nm

Cutting head

Spatial light shaping module

Performance

Effective working stroke

300x400mm(optional)

Repetitive positioning accuracy 

±1μm

Visual positioning

Automatic visual positioning
Slot depth

≥10µm

Others

Wafer size

8 inch (12inch is compatible )

Processing process

Protective liquid coating - wafer grooving - cleaning
Processing object Low - K wafers, silicon-based Gan, etc
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