Automobile Industry
Automotive Laser Manufacturing


































































































































































Product advantages:
There is no damage on the surface, no cutting seam, and the edge collapse is very small (≤ 2 μ m) , the edge is small (< 3 μ m)
Multi focus modification mode can be adopted to multiply the cutting efficiency
The laser has high average power stability (≤± 3% over 24 hours) and high beam quality (M ² < 1.5)
Sample display:
Schematic diagram of cutting section
8 inch silicon-based wafer, single point layer by layer modification, thickness 730 μ m

Upper surface (chip structure surface)
8 inch silicon-based wafer, single point layer by layer modification, thickness 730 μ m

Lower surface: chip structure surface
8 inch silicon-based wafer, single point layer by layer modification, thickness 730 μ m

| Item | Main parametetrs | |
| Laser | Center wavelength | Custom infrared wavelength |
| Cutting head | Self-developed collimating head | |
| Performance | Effective working stroke | 300x400mm(optional) |
| Repetitive positioning accuracy | ±1µm | |
| Visual positioning | Automatic visual positioning | |
| Processing method | Layer by layer upgrading, single point / multi-point processing | |
| Others | Wafer size | 8 inch (12inch is compatible ) |
| Processing process | Laser modified cutting - film spreading | |
| Processing object | MEMS chip, silicon-based biochip, silicon wheat chip, CMOS chip, etc | |