Wafer Cutting Series

Wafer Laser Modified Cutting Equipment

This equipment is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants.

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  • Product Description

Product advantages:

  • High quality

There is no damage on the surface, no cutting seam, and the edge collapse is very small (≤ 2 μ m) , the edge is small (< 3 μ m)

  • High efficiency

Multi focus modification mode can be adopted to multiply the cutting efficiency

  • Good stability

The laser has high average power stability (≤± 3% over 24 hours) and high beam quality (M ² < 1.5)

Sample display:

Schematic diagram of cutting section
8 inch silicon-based wafer, single point layer by layer modification, thickness 730 μ m

laser cutter

Upper surface (chip structure surface)
8 inch silicon-based wafer, single point layer by layer modification, thickness 730 μ m

laser cutter

Lower surface: chip structure surface
8 inch silicon-based wafer, single point layer by layer modification, thickness 730 μ m

laser cutter

  • Technical Parameters

Item Main parametetrs
Laser Center wavelength Custom infrared wavelength
Cutting head Self-developed collimating head
Performance Effective working stroke 300x400mm(optional)
Repetitive positioning accuracy ±1µm
Visual positioning Automatic visual positioning
Processing method Layer by layer upgrading, single point / multi-point processing
Others Wafer size 8 inch (12inch is compatible )
Processing process Laser modified cutting - film spreading
Processing object MEMS chip, silicon-based biochip, silicon wheat chip, CMOS chip, etc

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