LCK10G

PCB-IC CARRIER BOARD DEFECT IDENTIFICATION

Used for automatic and laser marking of scrap units on carrier products, which facilitates efficient and accurate identification of subsequent processes, and improves the product yield and process efficiency of customer factories.

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Product Features

  • Dual Station High-Speed Marking

    Double-station operation to realize high-speed processing of bad board marks on IC substrate.
  • Real-Time Energy Monitoring

    Configure energy monitoring system to ensure the stability of product processing effect.
  • Intelligent Scrap Position Acquisition

    It can automatically identify the front end process mark, or connect to the customer system to directly obtain the location information of the scrap board for marking.
  • Double-Sided Machining

    The flipping mechanism realizes double-sided processing of the product, no adjustment is required when changing materials, which improves production efficiency and ease of use.
  • Product Description

Equipment characteristics

  • Double-station operation to realize high-speed processing of bad board marks on IC substrate
  • Configure energy monitoring system to ensure the stability of product processing effect
  • It can automatically identify the front end process mark, or connect to the customer system to directly obtain the location information of the scrap board for marking
  • The flipping mechanism realizes double-sided processing of the product, no adjustment is required when changing materials, which improves production efficiency and ease of use

  • Technical Parameters

  ITEM MAIN TECHNICAL PARAMETERS
Laser system Laser type Green laser 532nm
Average output power 10W
Field lens scanning range 150×150mm
Main configuration Working platform Dual linear motor platform
Vision system Industrial CCD positioning and code reading system
Condition monitoring Laser energy monitoring system
Automatic loading and unloading system Loading and unloading drawer, vacuum adsorption system
Processing performance Processing size range 50×70 − 120×300mm
Mark processing accuracy ±0.01mm
Overall machining accuracy ±0.05mm
Processing board thickness 0.1mm − 1.2mm
Use environment Power supply specifications Temperature 10 − 35℃/Humidity<65%
Environmental 2800mm(W) × 2000mm(L) × 2000mm(H)

Samples

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