Automobile Industry
Automotive Laser Manufacturing


































































































































































Product advantages:
Cutting line width is narrow (taking ultraviolet collimation as an example, cutting line width + HAZ ≤ 20 ± 5 μ m) Small edge collapse (≤ 10 μ m)
UPH ≥ 10 (UV galvanometer: take 3-inch double mesa silicon diode wafer as an example, including automatic alignment time)
The laser has high pulse stability (≤ 2% RMS) and high beam quality (M ² ≤1.2)
Sample display:
Cutting front - 3-inch double mesa diode wafer laser full cutting; Grain size: 300 * 300 μm, Wafer thickness 130 μm, Cutting channel thickness 30 μm.

Cutting back - 3-inch double mesa diode wafer laser full cutting; Grain size: 300 * 300 μm, Wafer thickness 130 μm, Cutting channel thickness 30 μm.

| Item | Main parameters | ||
| Model | LUD3200 | LUD3210 | |
| Laser | Center wavelength | ~355nm | ~355nm |
| Cutting head | Laser scanning head | Laser collimator | |
| Performance | Effective working stroke | 200x300mm(optional)、DD motor | 200x300mm(optional)、DD motor |
| Repetitive positioning accuracy | ±2µm、±5arc sec | ±2µm、±5arc sec | |
| Visual positioning | Front positioning, front cutting | Front positioning, front cutting | |
| Scribe line width | ≤30±5µm | ≤20±5µm | |
| Others | Power supply specification | 220V/50Hz/3.5kW | 220V/50Hz/3.5kW |
| Overall size | 1500mm*1700mm*2000mm | 1500mm*1700mm*2000mm | |
| Weight | 1500 Kg | 1500 Kg | |