Picosecond Laser Scribing Equipment
Ultra violet picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers.

Product Data

Product advantages

  • High quality

          Cutting line width is narrow (taking ultraviolet collimation as an example, cutting line width + HAZ ≤ 20 ± 5 μ m) Small edge collapse (≤ 10 μ m)

  • High efficiency

          UPH ≥ 10 (UV galvanometer: take 3-inch double mesa silicon diode wafer as an example, including automatic alignment time)

  • Good stability

          The laser has high pulse stability (≤ 2% RMS) and high beam quality (M ² ≤1.2)

 

Sample display:

 

Cutting front - 3-inch double mesa diode wafer laser full cutting; Grain size: 300 * 300 μm, Wafer thickness 130 μm, Cutting channel thickness 30 μm.

laser cutter

 

 

Cutting back - 3-inch double mesa diode wafer laser full cutting; Grain size: 300 * 300 μm, Wafer thickness 130 μm, Cutting channel thickness 30 μm.

laser cutter

Item

Main parameters

Model

LUD3200

LUD3210

Laser

Center wavelength

~355nm

~355nm

Cutting head

Laser scanning head

Laser collimator

Performance

Effective working stroke

200x300mm(optional)DD motor

200x300mm(optional)DD motor

Repetitive positioning accuracy

±2μm±5arc sec

±2μm±5arc sec

Visual positioning

Front positioning, front cutting

Front positioning, front cutting

Scribe line width

≤30±5μm

20±5μm

Others

Power supply specification

220V/50Hz/3.5kW

220V/50Hz/3.5kW

Overall size

1500mm*1700mm*2000mm

1500mm*1700mm*2000mm

Weight

1500 Kg

1500 Kg

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