Automobile Industry
Automotive Laser Manufacturing


































































































































































Product advantages:
The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm
UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, including automatic loading and unloading)
Nanosecond laser has high power stability and good beam quality (M ² < 1.5)
Sample display:
Front positioning, front cutting: 4-inch flat wafer, grain

Front positioning, back cutting: 5-inch GPP wafer

| Item | Main parameters | ||
| Model | LUD3200 | LUD3210 | |
| Laser | Center wavelength | ~355nm | ~1064nm |
| Cutting head | Self-developed | Self-developed | |
| Performance | Effective working stroke | 200x300mm(optional)、DD motor | 200x300mm(optional)、DD motor |
| Repetitive positioning accuracy | ±2µm、±5arc sec | ±2µm、±5arc sec | |
| Visual positioning | Front positioning, front cutting | Front positioning, back cutting | |
| Scribe line width | ≤30±5µm | ≤40±5µm | |
| Others | Power supply specification | 220V/50Hz/3.5kW | 220V/50Hz/3.5kW |
| Overall size | 1150mm*800mm*1700mm | 1150mm*800mm*1700mm | |
| Weight | 1000 Kg | 1000 Kg | |