Laser Scribing Series

Nanosecond Laser Scribing Equipment

Nanosecond laser is used for precise dicing of GPP wafers.

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  • Product Description

Product advantages:

  • High processing quality

The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm

  • High processing efficiency

UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, including automatic loading and unloading)

  • Good processing stability

Nanosecond laser has high power stability and good beam quality (M ² < 1.5)

Sample display:

Front positioning, front cutting: 4-inch flat wafer, grain

laser cutting

Front positioning, back cutting: 5-inch GPP wafer

laser cutter

  • Technical Parameters

Item Main parameters
  Model LUD3200 LUD3210
Laser Center wavelength ~355nm ~1064nm
Cutting head Self-developed Self-developed
Performance Effective working stroke 200x300mm(optional)、DD motor 200x300mm(optional)、DD motor
Repetitive positioning accuracy ±2µm、±5arc sec ±2µm、±5arc sec
Visual positioning Front positioning, front cutting Front positioning, back cutting
Scribe line width ≤30±5µm ≤40±5µm
Others Power supply specification 220V/50Hz/3.5kW 220V/50Hz/3.5kW
Overall size 1150mm*800mm*1700mm 1150mm*800mm*1700mm
Weight 1000 Kg 1000 Kg

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