Purpose-built for consumer electronics (3C) and AI hardware applications, this high-performance green-laser metal 3D printing system uses laser beam powder bed fusion (PBF-LB) to process pure copper and copper alloys. With material absorptivity above 40%, green-laser processing addresses the high reflectivity, segregation, and poor densification often encountered when copper is processed using conventional infrared lasers. The system is optimized for fabricating complex microchannels and topology-optimized thermal components for high-frequency applications. Monolithic, joint-free fabrication eliminates interfaces that can add thermal resistance or create leakage risks. This helps customers manage rising chip power densities while enabling thinner, lighter thermal components and faster design validation.

Equipment Features

✓  Precision Green-Laser Control: Copper alloys absorb green-laser energy efficiently. Precise energy control minimizes porosity and cracking, enabling monolithic microchannels as small as 0.05 mm.

✓  Built for Long-Term Stability: Water cooling and optical protection mitigate build-chamber heating and thermal shock caused by copper’s high reflectivity, reducing thermal drift and maintaining stable, high-precision production of microchannels ≤ 0.05 mm over extended runs.

✓  AI-Enabled Productivity: AI vision monitors powder recoating, while multiple process-state inputs support stable production of complex copper-alloy parts and increase overall equipment utilization by 10%.